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Advances in micro miniaturization

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Advances in micro miniaturization conceived in the electronics industry, have been applied to shrinking the size of components necessary to implement pressure transducers. The status of ongoing research specifically oriented to fabrication, performance, and application of micro sensors was first described from the viewpoint of their use for heat transfer and fluid flow measurements (Udell, 1990).

The application of this technology to other domains outside of the electronics industry has become known as "surface machining," and has emerged during the last thirty (30) years as a viable technology (Halbo). At first the technology was considered to be spin-offs from related microelectronics/integrated circuit technology. Some of the first usage of the technology came with the application associated with the mounting of miniature strain gauges on silicon and devices so generated became known as "etched anisotropic silicon" devices.

Sensor applications gave the main market impetus while the economies of scale derived from the microelectronics induced batch processing permitted low cost. Thus silicon micro machining was able to establish itself as a unique processing technology with an extremely distinctive feature set.

Fabrication capabilities have continued to grow over the last twenty years and have produced a large number of actuator assembly combinations that include miniature motors, tweezers, accelerometers, and pressure sensors. It is now feasible to cons

. . .
ues associated with the fabrication of these devices are primarily based upon batch organized microelectronic process technology using techniques such as photolitography or anisotropic etching. While some micro machining techniques have been specially developed, such as anodic bonding, the former techniques are considered dominant in the field today. Photolithographic techniques have become viable as a result of advanced solid state technology developments associated with the fabrication of silicon-based microelectronic integrated circuits. Single-crystal silicon is the most widespread utilized material for micro machined devices. This is due to both the unique features of the material and the strong support from the microelecronic integrated circuit industry. Other materials are used as well including gallium arsenide, quartz and various polymer-based materials. Applications which have been best observed for sensors employing the above technology include those requiring the measurement of force, pressure, flow and acceleration. Sensors for measuring other parameters such as light or chemical effects have also been developed as a further exploitation of this technology. Actuator applications and those associated with min
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Some common words found in the essay are:
Intelligence Center, A/S Norway, Deposition LPCVDand, Technology Batch, Conclusions Recommendations, Technology Submicron, Background Advances, Seminars EECS, Microfluidics Stanford's, available on-line, February Downsizing, micro mechanical, micro machined, micro machining, integrated circuit, pressure sensors, mechanical devices, micro mechanical devices, machined devices, micro machined devices, micro scale, circuit industry, integrated circuit industry, integrated circuit processing, 1997 available on-line,
Approximate Word count = 4780
Approximate Pages = 19 (250 words per page)

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