The purpose of this research is to perform a marketing process analysis on the Blitz Company. The process analyzed involves the production of electronic circuit boards.
The process for the production of the eldctronic circuit boards is described in a process flow diagram. The diagram is presented in Figure 1, which may be found on the following page. As indicated in the diagram, the actual production occurs over a three stage process. In the preparation stage, plastic panels are obtained from inventory, inspected, sheared, and drilled to facilitate later processing. In the image transfer stage, the panels are chemically treated, touched up, plated, and etched. In the fabrication stage, the panels are again sheared (to final size), location holes are drilled, configuration is accomplished, final holes are drilled for eye lets and/or terminals, epoxy coating is applied, eyelets and/or terminals are installed, soldering is performed, and final inspection and packing are performed, before the completed boards are sent to shipping.
In a few instances, the process described is not followed completely. These instances occur when customers provide
Process Flow Diagram: Blitz Company
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( (
Purchase Copper Receive
Faced Plastic Customer
Panels Blueprint
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Panel Inventory Blueprint
( File
Inspect & Shear |P ( Panel |r ...